产品应用

产品应用

Application

Polishing Materials

JH-T28 and JH-T281 of special specifications with total metal ions less than 50ppb are important raw materials for semiconductor wafer CMP . Polishing solutions with different particle sizes can be prepared through the sol gel process for multi-level wafer polishing.

Related Products

Product Number

Chemical Name

CAS #

EC#

Molecular Formula

Molecular Weight

Main Application Areas

产品编号 : JH-T28

化学名称 : Tetraethoxysilane-28

CAS# : 78-10-4

EC# : 201-083-8

分子式 : C8H20O4Si

分子量# : 208.33

主要应用领域 : Filler、Foundry、Rubber、Resin、Adhesive、Paint、Aearosol

产品编号 : JH-T281

化学名称 : Tetramethoxysilane

CAS# : 681-84-5

EC# : N.A.

分子式 : C4H12O4Si

分子量# : 152.22

主要应用领域 : Filler、Foundry、Rubber、Resin、Adhesive、Paint、Aearosol

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